co-sponsored by


co-sponsored by



15-19 September 2008


The main themes for original contributions to be submitted to ESSDERC 2008 include, but are not limited to the following:

Advanced Devices
CMOS scaling; high performance, low power, and low voltage devices; SOI, SGOI, and SiON devices; SiGe, Ge, and strained devices; nano devices and related device physics; double and multi gate transistors; high mobility and ballistic devices.

Processing & Integration
Advances in integration for ULSI; SOI, SGOI, and SiON processing; 3D integration; new materials for CMOS; ICs patterning techniques; gate dielectrics; high k; gate stack and junction technology; silicidation; interconnects; low k dielectrics; damascene processing; cleaning and surface preparation.

Telecommunication & Power Devices
RF CMOS; passives; antennas; filters; resonators; inductors; RF MEMS/switches; SAW, BAW, and FBAR; oscillators, HBT; HEMT; bipolar devices; BiCMOS; high voltage and high power devices; SiC; high temperature operation; CMOS compatible power devices.

Modelling and Simulation
Compact, numerical, and physical modeling; device simulation; behavior models; quantum mechanical and non-stationary transport phenomena; ballistic transport; scattering models; process dispersions, parameter fluctuations, variability; TCAD; mixed electrical-thermal modelling and simulation.

Characterisation and Reliability
Characterisation techniques; parameter extraction; advanced test structures and methods; noise; gate dielectric, device, and interconnect reliability; CHE effects; NBTI; SILC; memory retention; process-induced damages, ESD, EMI; defect monitoring and control; metrology.

Memory, SoC & SiP
Embedded and stand-alone memories; DRAM, FeRAM, MRAM, PCRAM, CBRAM, Flash, SONOS; nanocrystal memories; single and few electron memories; 3D IC stacks; integrated MEMS and NEMS; integration of detectors, sensors, and actuators; CCDs and CMOS imagers; optical onchip communication, optical links; display technologies; TFTs; IC cooling techniques; SoC and SiP packaging; microsystem packaging.

Emerging Technologies, Sensors & Actuators
Nanotubes; single-electron, molecular and quantum devices; spintronics; self-assembling structures and emerging materials; photonic devices; light emission, APDs, single photon detectors; polymer transistors, sensors, light-emitting diodes and optoelectronic devices; flexible displays; biochemical sensors and actuators; microfluidic devices; micromachining; MEMS and NEMS.

Joint ESSDERC / ESSCIRC Sessions:
These sessions will focus on topics that that straddle the boundary between design and technology and are planned to include Sensors and Imagers, Integration of IC designs with other technologies and materials, Yield and Reliability related technology developments and Design for Manufacture

ESSDERC Paper Submission

The 2008 ESSCIRC conference will allow only electronic submission of papers in PDF format. Prospective authors must submit their paper(s) via the conference website.
Papers must be submitted in the final format to be published in the proceedings. They must not exceed four A4 pages with all illustrations and references included. The size of the PDF files submitted must not exceed 2 MBytes. Manuscript guidelines as well as instructions on how to submit electronically will be available here shortly.

Paper submission has now closed.

After selection of the papers for the conference, the authors will be informed of the decision of the Technical Programme Committee by e-mail at the beginning of June 2008. At the same time, the complete programme will be published on the conference website. The working language of the conference is English, which must also be used for all presentations and printed material.

Edinburgh Fringe

Papers submitted for review must clearly state:

The degree to which the paper deals with the above issues is fundamental to a successful review and selection of the paper. The most frequent cause of rejections of submitted papers is a lack of new results. Only work that has not been previously published at the time of the conference will be considered. Submission of a paper for review and subsequent acceptance is considered by the committee as a commitment that the work will not be placed in the public domain prior to the conference.

Edinburgh ESS-Fringe Poster Session

During ESSDERC/ESSCIRC a Fringe Poster Session will be held alongside the main conference and is designed primarily to introduce young engineers, scientists and students to the ESSDERC/CIRC conference series although, in the spirit of the Fringe, anyone who wishes to participate is very welcome. The forum is ideally suited for the submissions of recent progress which may, in some cases, not be ready for a full paper submission. Alternatively, contributions may present some breaking late news, some ideas which participants would like the opportunity to discuss topics or even collaboration opportunities with other participants at the conference. It is expected that the emphasis of fringe submissions will be on the presentation of the latest data (both measurement and/or simulation) as well as new ideas.

For further information including how to submit a contribution, please visit the Edinburgh Fringe site.